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Author: Umsebenzi Remote JOBS
A company is looking for a Senior Package Layout Engineer – Hardware.
Key Responsibilities:
Collaborate with design teams to implement high speed/density ASIC packages
Perform substrate breakout patterns for ASIC packages
Optimize package pinout and assist with package routing and placement
Required Qualifications:
B.S. in Electrical Engineering or equivalent experience
5+ years experience in PCB Layout of related technology
Significant background with Cadence APD or SiP and/or PCB layout tools
Proven experience in substrate layout of wire bond and flip chip packages
Experience with high-speed design signal integrity practices
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